Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Sensors
سال: 2020
ISSN: 1424-8220
DOI: 10.3390/s20041186